The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2014

Filed:

Jun. 29, 2010
Applicants:

Yoshikazu Yamazaki, Konosu, JP;

Satoshi Hayakawa, Saitama, JP;

Masashi Miyamoto, Saitama, JP;

Inventors:

Yoshikazu Yamazaki, Konosu, JP;

Satoshi Hayakawa, Saitama, JP;

Masashi Miyamoto, Saitama, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a low-cost method for easily forming a transparent conductive pattern that has a low electrical resistance and high transparency, and that is highly invisible to the eye. The method for forming a transparent conductive layer pattern includes the steps of (1) detachably forming a transparent conductive layer on a substrate; (2) then forming, on a support, a negative-patterned heat-sensitive adhesive image; (3) bonding the substrate to the support so that the transparent conductive layer and the heat-sensitive adhesive layer are in close contact with each other; (4) forming a pattern of the transparent conductive layer on the substrate by detaching the support from the substrate to transfer a portion of the transparent conductive layer, the portion being in close contact with the heat-sensitive adhesive layer, to the heat-sensitive adhesive layer; and (5) fixing the transparent conductive layer on the substrate by applying a coating material for a protective layer onto a front surface of the substrate on which the pattern of the transparent conductive layer is formed and impregnating the transparent conductive layer with the coating material.


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