The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Apr. 26, 2010
Hiroshi Takai, Tokyo, JP;
Hiroshi Takai, Tokyo, JP;
Sumco Corporation, Tokyo, JP;
Abstract
Disclosed is a semiconductor wafer polishing method for polishing the surfaces to be polished of semiconductor wafers by use of polishing pads () provided on fixing plates by relative movement of the polishing pads and the semiconductor wafers held by carriers. The shaping surfaces () of a polishing pad shaping jig () are shaped by inverting, with respect to ideal shapes, the shapes of the surfaces to be polished of each semiconductor wafer when the surfaces are polished by use of the polishing pads () before shaping, and the shapes of the shaping surfaces of the polishing pad shaping jig are transferred to the pad surfaces (A andA) of the respective polishing pads (). The surfaces to be polished of each semiconductor wafer are polished by use of the pad surfaces.