The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Mar. 12, 2012
Wayne O. Duescher, Roseville, MN (US);
Wayne O. Duescher, Roseville, MN (US);
Other;
Abstract
Three rotary wafer abrasive lapping spindles having attached wafers are mounted on the flat surface of a granite lapping machine base. A flexible raised island abrasive disk is attached to the annular abrading surface of an abrading platen that is rotated at high speeds to flat lap, or polish, the exposed surfaces of the rotating wafers. Resilient wafer pads are used to minimize the effects of the abraded surfaces of the wafers not being precisely parallel to the platen abrading surface due to misalignment of the spindle tops. The resilient pads also compensate for two opposed flat surfaces of wafers not precisely parallel with each other. A mixture of the same types of chemicals that are used in the conventional CMP polishing of wafers with applied coolant water can be used with this abrasive lapping or polishing system to enhance abrading and to continually wash abrading debris from the wafers.