The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2014

Filed:

May. 07, 2010
Applicants:

Kenichi Kaida, Osaka, JP;

Hideki Sumi, Yamanashi, JP;

Masahiro Kihara, Yamanashi, JP;

Kenichirou Ishimoto, Yamanashi, JP;

Noboru Higashi, Yamanashi, JP;

Inventors:

Kenichi Kaida, Osaka, JP;

Hideki Sumi, Yamanashi, JP;

Masahiro Kihara, Yamanashi, JP;

Kenichirou Ishimoto, Yamanashi, JP;

Noboru Higashi, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing sectionwhich determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item. In a mounting availability determining process, an availability of an execution of a mounting operation for the mounting object component is automatically determined based on preset failure patterns of the detection result.


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