The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Feb. 25, 2010
Tohru Nakagawa, Shiga, JP;
Hideo Torii, Osaka, JP;
Tohru Nakagawa, Shiga, JP;
Hideo Torii, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A method for mounting an electronic circuit-constituting member on a substrate. The method includes preparing a substrate having a surface comprising a liquid-attracting first region and a liquid-repelling second region that surrounds the first region. The method also includes bringing water into contact with the surface of the substrate so as to dispose said water only on the said first region. The method further includes subjecting said substrate to a member-containing liquid that includes an organic solvent where an electronic circuit-constituting member are dispersed in the organic solvent to move said electronic circuit-constituting member to said water disposed on the said first region. The surface of the member is chemically modified with a silane coupling agent including a group with a C—Cl bond. Also, the method includes removing the water and the organic solvent from the surface of the substrate to mount said electronic circuit-constituting member on said substrate.