The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Sep. 29, 2008
Yoshiaki Ogino, Nakai-machi, JP;
Katsumi Kimura, Nakai-machi, JP;
Yasuhiro Iida, Nakai-machi, JP;
Kazuhiro Soga, Nakai-machi, JP;
Yoshiaki Ogino, Nakai-machi, JP;
Katsumi Kimura, Nakai-machi, JP;
Yasuhiro Iida, Nakai-machi, JP;
Kazuhiro Soga, Nakai-machi, JP;
Hitachi Information & Telecommunication Engineering, Ltd., Yokohama-shi, Kanagawa-ken, JP;
Abstract
To project a rectangular laser spot having a predetermined size and a high laser power density onto the surface of an object, a semiconductor manufacturing apparatus comprises a control unit for controlling power of a laser light source, an optical waveguide unit () including a core section () transmitting laser light and a clad section () covering the core section (), and a lens () for forming the laser light output through the optical waveguide unit () into a laser spot having a predetermined shape, an output end surface () of the core section () has a rectangular shape with one side length of 1 μm to 20 μm and the other side length of 1 mm to 60 mm, and the laser source is set to make the power density of the laser spot output from the core section () to be 0.1 mW/μmor more.