The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8644025 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 04, 2014

Filed:

Dec. 22, 2010
Applicants:

Huan Chin Luo, Hsinchu, TW;

Hua Ting Chang, Hsinchu, TW;

Chin Sheng Lin, Hsinchu, TW;

Chih Cheng Lin, Hsinchu, TW;

Chung Pei Hung, Hsinchu, TW;

Inventors:

Huan Chin Luo, Hsinchu, TW;

Hua Ting Chang, Hsinchu, TW;

Chin Sheng Lin, Hsinchu, TW;

Chih Cheng Lin, Hsinchu, TW;

Chung Pei Hung, Hsinchu, TW;

Assignee:

Mxtran Inc., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit (IC) film for a smart card is provided. The IC film includes a flexible printed circuit (FPC) board, first electrical contacts, second electrical contacts, and an IC chip. The first electrical contacts are disposed on a first side of the FPC board, and the second electrical contacts are disposed on a second side of the FPC board. The IC chip is disposed on the FPC board and bonded to the leads of the FPC board to thereby form electrical connection. The total thickness of the FPC board and the chip is not larger than 0.5 mm.


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