The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Jul. 31, 2012
Shigeyuki Nakazato, Chiyoda-ku, JP;
Yoichi Goto, Chiyoda-ku, JP;
Kiyofumi Kitai, Chiyoda-ku, JP;
Toru Kimura, Chiyoda-ku, JP;
Shigeyuki Nakazato, Chiyoda-ku, JP;
Yoichi Goto, Chiyoda-ku, JP;
Kiyofumi Kitai, Chiyoda-ku, JP;
Toru Kimura, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A power semiconductor device includes: a mold unit that includes a power semiconductor element, a base plate, and a mold unit, the power semiconductor element being mounted on one surface of the base plate, a convex portion being formed on an other surface of the base plate, the convex portion including a plurality of grooves, the mold unit having a mold resin with which the power semiconductor element is sealed in such a manner as to expose the convex portion; a plurality of radiation fins inserted into the grooves, respectively, and fixedly attached to the base plate by swaging; and a metal plate that includes a opening into which the convex portion is inserted, the metal plate being arranged between the mold unit and the radiation fins with the convex portion inserted into the opening, wherein the metal plate includes a protrusion that protrudes from an edge of the opening and that digs into a side surface of the convex portion when the convex portion is inserted into the opening.