The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2014

Filed:

Jun. 30, 2010
Applicant:

Beat Krattiger, Beringen, CH;

Inventor:

Beat Krattiger, Beringen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for adhesive bond joining of two surfaces, where a metallic or non-metallic solder is applied to at least one of the two surfaces, where the solder has a temperature-dependent optical property. The solder is radiated with electromagnetic radiation with a predetermined spectrum, such that the solder reaches a predetermined temperature above its melting temperature and moistens the surfaces, such that the temperature-dependent optical property is modified reversibly or irreversibly at the predetermined temperature of the solder. The solder is cooled to below its melting temperature, such that the solder solidifies and connects the surfaces in an adhesive bond.


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