The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Mar. 17, 2009
Kazunori Kuga, Aichi, JP;
Takashi Mizuno, Aichi, JP;
Toshihiko Kariya, Aichi, JP;
Nobuhiro Uchida, Aichi, JP;
Koji Suzuki, Aichi, JP;
Kazunori Kuga, Aichi, JP;
Takashi Mizuno, Aichi, JP;
Toshihiko Kariya, Aichi, JP;
Nobuhiro Uchida, Aichi, JP;
Koji Suzuki, Aichi, JP;
Mitsubishi Heavy Industries Plastic Technology Co., Ltd., Nagoya-shi, Aichi, JP;
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Abstract
There is provided a mold clamping apparatus that can prevent a molding material from spouting from a split surface of a mold even if in-cavity resin pressure causes offset of a mold opening force, and can extend the life of the mold. The mold clamping apparatus includes a control device that estimates a mold opening force by mold internal pressure for molding with mold internal pressure being asymmetrical with respect to a center of a mold block, determines a mold clamping hydraulic value applied to each tie bar correspondingly to the estimated mold opening force, and distributes hydraulic pressure supplied to each tie bar so that the determined mold clamping hydraulic value is reached.