The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Sep. 13, 2011
Tsutomu Kono, Kawasaki, JP;
Keiji Hanzawa, Mito, JP;
Takeshi Morino, Hitachinaka, JP;
Yuki Okamoto, Hitachinaka, JP;
Noboru Tokuyasu, Hitachinaka, JP;
Shinobu Tashiro, Hitachinaka, JP;
Tsutomu Kono, Kawasaki, JP;
Keiji Hanzawa, Mito, JP;
Takeshi Morino, Hitachinaka, JP;
Yuki Okamoto, Hitachinaka, JP;
Noboru Tokuyasu, Hitachinaka, JP;
Shinobu Tashiro, Hitachinaka, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FSof the present invention, a part of a semiconductor chip CHPis configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHPis exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHPin a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP) and the resin (MR).