The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2014

Filed:

Feb. 20, 2013
Applicant:

Hgst Netherlands B.v., Amsterdam, NL;

Inventors:

Yimin Hsu, Sunnyvale, CA (US);

Stefan Maat, San Jose, CA (US);

Arley Cleveland Marley, San Jose, CA (US);

Alexander M. Zeltser, San Jose, CA (US);

Assignee:

HGST Netherlands B.V., Amsterdam, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/39 (2006.01); G11B 5/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A current-perpendicular-to-the-plane magnetoresistive sensor structure includes at least an improved top shield structure and optionally also a similar bottom shield structure. The top shield structure includes an antiparallel structure (APS) of two ferromagnetic films and a nonmagnetic antiparallel coupling (APC) film between them. The APC film induces antiferromagnetic (AF) coupling between the two ferromagnetic films so that they have their respective magnetizations oriented antiparallel. An important aspect of the APS is that there is no antiferromagnetic layer adjacent the upper ferromagnetic film, so that the upper ferromagnetic film does not have its magnetization pinned by an antiferromagnetic layer. An electroplated shield layer is formed above the APS. A nonmagnetic decoupling layer is located between the APS and the electroplated shield layer to prevent domain wall movement in the electroplated shield from transferring to the ferromagnetic layers in the APS and thus possibly induce noise in the sensor.


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