The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2014

Filed:

Feb. 28, 2012
Applicant:

YE Wang, Cupertino, CA (US);

Inventor:

Ye Wang, Cupertino, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods of testing packaged thin-film piezoelectric-on-semiconductor (TPoS) microelectromechanical resonators having hermetic seals include measuring a quality factor (Q) of resonance of the packaged resonator at at least two unequal temperatures to determine whether a ΔQ/ΔT is significantly different (e.g, by at least 50%) over a temperature range (ΔT) spanning a smallest and largest of the at least two temperatures. These measurements are performed for a packaged resonator having a Q<Q, where Qis the quality factor of resonance of the packaged resonator due to air damping and Qis the quality factor of resonance of the packaged resonator due to thermoelastic damping.


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