The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Apr. 23, 2012
Chun Yu Wong, Clifton Park, NY (US);
Ramakanth Alapati, Rexford, NY (US);
Teck Jung Tang, Ballston Lake, NY (US);
Chun Yu Wong, Clifton Park, NY (US);
Ramakanth Alapati, Rexford, NY (US);
Teck Jung Tang, Ballston Lake, NY (US);
GLOBALFOUNDRIES, Inc., Grand Cayman, KY;
Abstract
A method of forming an integrated circuit device includes providing a substrate including an active device, forming a through silicon via into the substrate, forming a device contact to the active device, forming a conductive layer over the through silicon via and the device contact, and forming a connecting via structure for electrically connecting the conductive layer with the through silicon via. An integrated circuit device includes a through silicon via formed into a substrate silicon material, a conductive layer formed over the through silicon via, and a connecting via structure formed between the conductive layer and the through silicon via for electrically connecting the conductive layer with the through silicon via. The connecting via structure comprises a first series of via bars intersected with a second series of via bars.