The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Sep. 21, 2010
Hidenori Egoshi, Fukuoka-ken, JP;
Hiroaki Oshio, Fukuoka-ken, JP;
Teruo Takeuchi, Fukuoka-ken, JP;
Kazuhiro Inoue, Fukuoka-ken, JP;
Iwao Matsumoto, Fukuoka-ken, JP;
Satoshi Shimizu, Fukuoka-ken, JP;
Hidenori Egoshi, Fukuoka-ken, JP;
Hiroaki Oshio, Fukuoka-ken, JP;
Teruo Takeuchi, Fukuoka-ken, JP;
Kazuhiro Inoue, Fukuoka-ken, JP;
Iwao Matsumoto, Fukuoka-ken, JP;
Satoshi Shimizu, Fukuoka-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, the LED chip includes a semiconductor layer which contains at least indium, gallium and aluminum, one terminal of the LED chip is connected to the first lead frame, and another terminal of the LED chip is connected to the second lead frame. The resin body covers the LED chip and an entire upper surface, a part of a lower surface, and parts of edge surfaces of each of the first and second lead frames, and the resin body exposes a rest of the lower surface and a rest of the edge surfaces. And, an appearance of the resin body is a part of an appearance of the LED package.