The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Jan. 14, 2011
Kyoung Hwan Lim, Gyeongsangnam-do, KR;
Won Hyung Park, Busan, KR;
Kyoung Hwan Lim, Gyeongsangnam-do, KR;
Won Hyung Park, Busan, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Abstract
Disclosed herein is a printed circuit board, including: a substrate; a first circuit layer formed on the substrate; a first insulation layer formed on the first circuit layer and having a pattern corresponding to that of the first circuit layer; and a second insulation layer formed on the substrate such that the second insulation layer surrounds the first circuit layer and the first insulation layer formed on the first circuit layer. The printed circuit board is advantageous in that process time and process cost can be reduced because a first insulation layer is used as an etching resist and is included as a part of a printed circuit board even after etching.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile