The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Jul. 30, 2010
Applicants:
Hayato Kotani, Tsukuba, JP;
Naoyuki Urasaki, Tsukuba, JP;
Makoto Mizutani, Tsukuba, JP;
Inventors:
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C 35/02 (2006.01); B29C 39/36 (2006.01); B29C 39/38 (2006.01); C08G 63/00 (2006.01); C08K 3/22 (2006.01); C08K 7/28 (2006.01); C08L 63/00 (2006.01); C08L 63/06 (2006.01); H01L 23/06 (2006.01); F21V 7/22 (2006.01);
U.S. Cl.
CPC ...
Abstract
The epoxy resin molding material of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the (B) curing agent contains a polyvalent carboxylic acid condensate. The thermosetting resin composition of the invention comprises (A) an epoxy resin and (B) a curing agent, wherein the viscosity of the (B) curing agent is 1.0-1000 mPa·s at 150° C., as measured with an ICI cone-plate Brookfield viscometer.