The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Jan. 14, 2011
Susumu Sugano, Ichihara, JP;
Susumu Sugano, Ichihara, JP;
Toyoda Gosei Co., Ltd., Aichi-ken, JP;
Abstract
A method of producing a semiconductor wafer, which includes: placing a wafer () provided with a substrate () and a semiconductor layer () formed thereon, on a carrier plate (fixing plate) () of a grinder via fixing wax (and) such that the surface () to be ground faces upward; heating the carrier plate to soften the fixing wax; pressure-contacting the wafer from the side of the surface () to be ground using an air bag such that a portion of the softened fixing wax spreads and protrudes from the peripheral edge of the wafer; cooling the carrier plate while applying pressure to cure the fixing wax and fix the wafer onto the carrier plate; and rotating the surface () to be ground of the fixed wafer while pressure-contacting the surface () to the grinding plate of the grinder, thereby grinding the surface () to be ground.