The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Sep. 06, 2007
Applicants:
Kenjin Shiba, Uji, JP;
Takuma Yano, Uji, JP;
Masafumi Yamada, Uji, JP;
Takamasa Yoshino, Uji, JP;
Inventors:
Assignee:
Unitika Ltd., Hyogo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/00 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); C08L 31/00 (2006.01); C08L 3/00 (2006.01); C08L 33/06 (2006.01); C09D 5/02 (2006.01); C08F 220/06 (2006.01); C09B 67/00 (2006.01); B28B 3/20 (2006.01); B29C 47/00 (2006.01); B05D 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a packaging material, wherein a barrier layer, an adhesive layer and a sealant layer are laminated in this order, and the adhesive layer includes an acid-modified polyolefin resin that contains a (meth)acrylic acid ester component. The packaging material is preferably produced by forming on the barrier layer the adhesive layer including the acid-modified polyolefin resin that contains a (meth)acrylic acid ester component, and by subsequently laminating a molten sealant resin on the adhesive layer by extrusion lamination.