The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2014
Filed:
Feb. 12, 2008
Toyoaki Kishi, Tokyo, JP;
Toyoaki Kishi, Tokyo, JP;
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Abstract
An objective of this invention is to provide an interlayer dielectric film with a carrier material used in a multilayer printed circuit board, which exhibits sufficient rigidity for a thin multilayer printed circuit board. According to the present invention, there is provided an interlayer dielectric film with a carrier material comprising a carrier material comprised of a metal foil or resin film and an interlayer dielectric film formed on one side of the carrier material, wherein the interlayer dielectric film is comprised of a base material impregnated with a resin; the base material has a thickness of 8 μm to 20 μm; and when the resin is cured at 170° C. for one hour under a pressure of 30 kgf/cm, an elongation percentage of the interlayer dielectric film in a planar direction is 0.05% or less as determined by a TMA method.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile