The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2014

Filed:

Jun. 22, 2012
Applicants:

Dennis E. Ferguson, Mahtomedi, MN (US);

Satinder K. Nayar, Woodbury, MN (US);

Stanley Rendon, Eagan, MN (US);

Donald L. Pochardt, Hastings, MN (US);

James N. Dobbs, Woodbury, MN (US);

Inventors:

Dennis E. Ferguson, Mahtomedi, MN (US);

Satinder K. Nayar, Woodbury, MN (US);

Stanley Rendon, Eagan, MN (US);

Donald L. Pochardt, Hastings, MN (US);

James N. Dobbs, Woodbury, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); D06N 7/04 (2006.01); G11B 5/64 (2006.01);
U.S. Cl.
CPC ...
Abstract

Articles enabled by an injection molding process that molds parts on a carrier web located between mold halves and uses ultrasonic energy to assist flow of polymer melt into the mold cavity. One such article is a carrier web having a high density of molded parts, i.e., bearing an array of molded articles adhered to the web in rows and columns, the articles being spaced closer (center-to-center or edge-to-edge) than the diagonal spacing between articles in the next adjacent row and next adjacent column. Another such article is a microneedle array on a land no more than 250 μm thick on which at least 60% of the microneedles across the array are filled (i.e., completely formed).


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