The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2014

Filed:

Oct. 29, 2008
Applicants:

Oliver Muth, Berlin, DE;

Andre Leopold, Berlin, DE;

Malte Pflughhoefft, Berlin, DE;

Jorg Fischer, Berlin, DE;

Manfred Paeschke, Basdorf, DE;

Heinz Pudleiner, Krefeld, DE;

Cengiz Yesildag, Leverkusen, DE;

Klaus Meyer, Dormagen, DE;

Inventors:

Oliver Muth, Berlin, DE;

Andre Leopold, Berlin, DE;

Malte Pflughhoefft, Berlin, DE;

Jorg Fischer, Berlin, DE;

Manfred Paeschke, Basdorf, DE;

Heinz Pudleiner, Krefeld, DE;

Cengiz Yesildag, Leverkusen, DE;

Klaus Meyer, Dormagen, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/08 (2006.01); B32B 37/14 (2006.01); B42D 15/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a method for making a structure with at least a first polymer layer and a second polymer layer, each made from a polycarbonate polymer based on bisphenol A, between the polymer layers a component being arranged, comprising the following steps: a) the component is arranged on the first polymer layer or placed in a depression of the first polymer layer, b) the first polymer layer is coated on the side, on which or in which the component is arranged, at least in the region of the component with a liquid preparation comprising a solvent or a mixture of solvents and a polycarbonate derivative based on a geminally disubstituted dihydroxydiphenyl cycloalkane, c) optionally a drying step is made after step b), d) after step b) or step c), the second polymer layer is placed on the first polymer layer, covering the component, e) the first polymer layer and the second polymer layer are laminated with each other under pressure, at a temperature from 120° C. to 180° C. and for a defined time.


Find Patent Forward Citations

Loading…