The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2014

Filed:

Sep. 08, 2009
Applicants:

Eric Kline, Rochester, MN (US);

Paul N. Krystek, Highland, NY (US);

Paul R. Michels, Rochester, MN (US);

Susan J. Swenson, Rochester, MN (US);

Stephen M. Zins, Oronoco, MN (US);

Inventors:

Eric Kline, Rochester, MN (US);

Paul N. Krystek, Highland, NY (US);

Paul R. Michels, Rochester, MN (US);

Susan J. Swenson, Rochester, MN (US);

Stephen M. Zins, Oronoco, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit dual-fluid heat exchanger has a housing containing first and second immiscible fluids. A heat-introducing base element contacts the first fluid. A heat-receiving surface on the base element is configured for interfacial contact with a heat-radiating surface of an integrated circuit device. A heat-removing condenser element contacts the second fluid, or is separated therefrom by a gap. The first and second fluids are selected to controllably remove heat from the integrated circuit device by forming heated mass units of the first fluid that migrate through the second fluid and come into contact with the condenser element, where they are cooled and allowed to return to the base element. A heat-expulsion portion on the condenser element is configured to dissipate heat removed by the condenser element to an exterior environment outside the heat exchanger.


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