The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2014
Filed:
Sep. 28, 2012
Murata Manufacturing Co., Ltd., Kyoto, JP;
Yoichiro Ito, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
An electronic component and manufacturing method for preparing an electronic component includes providing a first insulator layer having a first nickel content rate. A coil conductor and a second insulator layer having a first bismuth content rate and a second nickel content rate higher than the first nickel content rate are provided on the first insulator layer. The first insulator layer, the coil conductor, and the second insulator layer constitute a first unit layer. The first unit layer and an exterior insulator layer are laminated to obtain a laminate. After a step of firing the laminate, a nickel content rate in a first portion of the first insulator layer, the first portion being sandwiched between the coil conductors from both sides facing in a lamination direction, is lower than a nickel content rate in a second portion of the first insulator layer other than the first portion.