The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2014
Filed:
Mar. 01, 2010
Applicants:
Fifin Sweeney, San Diego, CA (US);
Milind P. Shah, San Diego, CA (US);
Mario Francisco Velez, San Diego, CA (US);
Damion B. Gastelum, San Diego, CA (US);
Inventors:
Fifin Sweeney, San Diego, CA (US);
Milind P. Shah, San Diego, CA (US);
Mario Francisco Velez, San Diego, CA (US);
Damion B. Gastelum, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a multi-module integrated circuit package having a package substrate and package contacts, a die is embedded in the package substrate with thermal vias that couple hotspots on the embedded die to some of the package contacts.