The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2014
Filed:
Mar. 11, 2011
Tetsuro Yamada, Kawasaki, JP;
Takahiro Ooi, Kawasaki, JP;
Yoshihiro Morita, Kawasaki, JP;
Akiko Matsui, Kawasaki, JP;
Misuhiko Sugane, Kawasaki, JP;
Takahide Mukoyama, Kawasaki, JP;
Tetsuro Yamada, Kawasaki, JP;
Takahiro Ooi, Kawasaki, JP;
Yoshihiro Morita, Kawasaki, JP;
Akiko Matsui, Kawasaki, JP;
Misuhiko Sugane, Kawasaki, JP;
Takahide Mukoyama, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.