The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2014
Filed:
Nov. 30, 2011
Christian René Bonhôte, Sunnyvale, CA (US);
Linden James Crawforth, San Jose, CA (US);
Toshiki Hirano, San Jose, CA (US);
Fu-ying Huang, San Jose, CA (US);
Neil Leslie Robertson, Palo Alto, CA (US);
Barry Cushing Stipe, San Jose, CA (US);
Christian René Bonhôte, Sunnyvale, CA (US);
Linden James Crawforth, San Jose, CA (US);
Toshiki Hirano, San Jose, CA (US);
Fu-Ying Huang, San Jose, CA (US);
Neil Leslie Robertson, Palo Alto, CA (US);
Barry Cushing Stipe, San Jose, CA (US);
HGST Netherlands B.V., Amsterdam, NL;
Abstract
The present invention generally relates to fabricating a bond pad for electrically connecting a laser diode to a slider and a TAR head in a HDD. The bond pad is deposited on a surface of the head that is perpendicular to the air bearing surface (ABS). The head is diced and lapped to expose the bond pad on a top surface of the head and mounted on a slider. The laser diode and a sub-mount may be coupled to the top surface of the slider—i.e., the surface opposite the ABS—by connecting to the bond pads. Specifically, both the laser diode and the sub-mount have electrodes thereon that are perpendicular to the bond pads. Conductive bonding material is used to bond the laser diode and the sub-mount to the bond pads.