The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2014

Filed:

Mar. 17, 2011
Applicants:

Yu-su Kim, Gyeonggi-do, KR;

Kyu-sub Kwak, Suwon-si, KR;

Young-min Lee, Yongin-si, KR;

Shi-yun Cho, Anyang-si, KR;

Jae-hyuck Lee, Anyang-si, KR;

Se-ho Park, Suwon-si, KR;

Youn-ho Choi, Seoul, KR;

Seung-woo Han, Seoul, KR;

Ji-hyun Jung, Seongnam-si, KR;

Inventors:

Yu-Su Kim, Gyeonggi-do, KR;

Kyu-Sub Kwak, Suwon-si, KR;

Young-Min Lee, Yongin-si, KR;

Shi-Yun Cho, Anyang-si, KR;

Jae-Hyuck Lee, Anyang-si, KR;

Se-Ho Park, Suwon-si, KR;

Youn-Ho Choi, Seoul, KR;

Seung-Woo Han, Seoul, KR;

Ji-Hyun Jung, Seongnam-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/323 (2013.01);
Abstract

A large capacity memory module mounting device employed in a portable terminal is provided, including a large capacity memory module including a plurality of first contact pads; and a flexible circuit board including a plurality of second contact pads and electrically connected to the large capacity memory module by forming solder pads in a heating process after the first and second contact pads are positioned in a face-to-face manner. Accordingly, the large capacity memory module can be advantageously mounted to the portable terminal and an electromagnetic field can be effectively shielded.


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