The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2014

Filed:

Mar. 04, 2011
Applicants:

Kei Kadomoto, Shioya-gun, JP;

Daiki Kudo, Shioya-gun, JP;

Takeshi Nakamura, Shioya-gun, JP;

Hiroyuki Nakade, Shioya-gun, JP;

Inventors:

Kei Kadomoto, Shioya-gun, JP;

Daiki Kudo, Shioya-gun, JP;

Takeshi Nakamura, Shioya-gun, JP;

Hiroyuki Nakade, Shioya-gun, JP;

Assignee:

Keihin Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device is provided with a power module capable of supplying an alternate current to a load, while a direct current is supplied from a battery to the power module for conversion into the alternate current, a cooling member capable of radiating heat generated by the power module, and a mounting member, integrally formed with a spring portion protruding in part therefrom and having elasticity, which allows the power module to be mounted on the cooling member under a state where one surface of the power module is caused to face the cooling member and the spring portion is pressed against the other surface of the power module in opposition to the one surface thereof.


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