The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2014
Filed:
Dec. 09, 2011
Young Ki Lee, Gyunggi-do, KR;
Young Ho Sohn, Gyunggi-do, KR;
Kwang Soo Kim, Gyunggi-do, KR;
Chang Hyun Lim, Seoul, KR;
Young Ki Lee, Gyunggi-do, KR;
Young Ho Sohn, Gyunggi-do, KR;
Kwang Soo Kim, Gyunggi-do, KR;
Chang Hyun Lim, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd, Gyunggi-Do, KR;
Abstract
Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one side of one surface of the first substrate; and a first lead frame contacting the other side of one surface of the first substrate. The power module package further includes: a first metal layer formed on one side of one surface of the first substrate; a first bonding layer formed on the first metal layer and contacting a lower surface of the second substrate; a second metal layer formed on the other side of one surface of the first substrate; and a second bonding layer formed on the second metal layer and contacting a lower surface of the first lead frame.