The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2014

Filed:

Jul. 26, 2010
Applicants:

Takehiko Okabe, Ichihara, JP;

Kyousuke Masuya, Ichihara, JP;

Inventors:

Takehiko Okabe, Ichihara, JP;

Kyousuke Masuya, Ichihara, JP;

Assignee:

Toyoda Gosei Co., Ltd., Aichi-ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The disclosed semiconductor light-emitting element is configured from layering an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer (); and a first electrode (), which is the cathode, is formed on the p-type semiconductor layer (). Also, between the p-type semiconductor layer () and a reflecting layer (), the first electrode () is provided with a crystalline first transparent electrode layer () and a non-crystalline second transparent electrode layer (). The crystalline first transparent electrode layer () increases adhesion with the p-type semiconductor layer (), and the non-crystalline second transparent electrode layer () suppresses delamination of the reflecting layer (). Also, the first transparent electrode layer () and the second transparent electrode layer () transmit light emitted from the light-emitting layer and suppress degradation of reflective characteristics. In this way, delamination of the reflecting layer and degradation of reflective characteristics are suppressed in a semiconductor light-emitting element mounted using flip-chip (FC) mounting.


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