Hybrid integrated circuits and their methods of fabrication

Abstract

The present invention provides architectures for hybrid integrated circuits and methods for producing these hybrid integrated circuits that contain both field programmable gate arrays and mask programmable gate arrays, a form of application specific integrated circuits. Methods for producing an integrated circuit that is field programmable as well as mask programmable include the steps of: designing wafer bank layers and finishing layers, where the wafer bank layers provide a plurality of selectable functional blocks; fabricating said wafer bank layers; designing mask programmed interconnect layers for said integrated circuit, where the interconnect layers interconnect selected ones of the plurality of functional blocks from the wafer bank layers; fabricating the interconnect layers on the wafer bank layers; and fabricating the finishing layers on the interconnect layers to produce the integrated circuit. Architectures for these integrated circuits can contain a field programmable gate array that is integrated with a mask programmable gate array in a ring structure.