The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2014

Filed:

Aug. 02, 2010
Applicants:

Mark W. Mcpherson, Otsego, MI (US);

William R. Mcpherson, Otsego, MI (US);

Inventors:

Mark W. McPherson, Otsego, MI (US);

William R. McPherson, Otsego, MI (US);

Assignee:

Tengam Engineering, Inc., Otsego, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a bonded metal assembly having a form and a powdered metal-filled plastic member with a cylindrical surface generally surrounding the form includes providing a mold having a cylindrical interior surface corresponding to the cylindrical surface of the resulting powdered metal-filled plastic member and providing a gate to the mold. The gate extends at least partially along a radius of the cylindrical interior surface of the mold. With the form positioned in the mold, a powdered metal-filled plastic material is injected through the gate to the mold and flowed around the form. A resulting bonded metal assembly includes a form and a powdered metal-filled plastic member having a cylindrical surface generally surrounding the form. The powdered metal-filled plastic member includes an injection-molding gate line extending at least partially along a radius of the cylindrical surface.


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