The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2014

Filed:

Oct. 23, 2009
Applicants:

Motoki Kakui, Yokohama, JP;

Kazuo Nakamae, Yokohama, JP;

Shinobu Tamaoki, Yokohama, JP;

Inventors:

Motoki Kakui, Yokohama, JP;

Kazuo Nakamae, Yokohama, JP;

Shinobu Tamaoki, Yokohama, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a laser processing method and the like which use no wavelength conversion technique by nonlinear optical crystals when selectively removing an insulating layer of a printed board, while employing only one wavelength throughout the entire removal processing. A laser processing apparatus (), preferably used in the laser processing method, has a MOPA structure and comprises a seed light source (), a YbDF (), a bandpass filter (), a YbDF (), a bandpass filter (), a YbDF (), a YbDF (), and so forth. The laser processing method according to the present invention is a laser processing method of removing an insulating layer comprised of a resin laminated on a conductor layer by irradiating it with pulsed laser light outputted from the laser processing apparatus () and uses laser light having a wavelength at which the light absorbed by the conductor layer is less than 10%, and sets the fluence per one pulse to a fracture damage threshold of the insulating layer or higher.


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