The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2014
Filed:
May. 12, 2010
Koji Asakawa, Tokyo, JP;
Ryota Kitagawa, Tokyo, JP;
Akira Fujimoto, Tokyo, JP;
Yoshiaki Shirae, Tokyo, JP;
Tomohiro Yorisue, Tokyo, JP;
Akihiko Ikeda, Tokyo, JP;
Koji Asakawa, Tokyo, JP;
Ryota Kitagawa, Tokyo, JP;
Akira Fujimoto, Tokyo, JP;
Yoshiaki Shirae, Tokyo, JP;
Tomohiro Yorisue, Tokyo, JP;
Akihiko Ikeda, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Asahi Kasei E-Materials Corporation, Tokyo, JP;
Abstract
Disclosed are: a resin composition for pattern formation, which enables the stable formation of a pattern at a level of the wavelength of light; a method for forming a pattern having a sea-island structure using the composition; and a process for producing a light-emitting element that can achieve high luminous efficiency properties. The resin composition for pattern formation comprises: (a) a specific block copolymer containing an aromatic ring-containing polymer and a poly(meth)acrylate as block moieties; (b) a homopolymer of a specific aromatic ring-containing polymer; and (c) a homopolymer of a specific poly(meth)acrylate, wherein the ratio of the total amount of the aromatic ring-containing homopolymer (b) and the poly(meth)acrylate homopolymer (c) relative to the entire resin composition is 0% by weight to 90% by weight, and the total amount of an aromatic ring-containing polymer moiety contained in the block copolymer (a) as a block moiety and the aromatic ring-containing homopolymer (b) relative to the entire resin composition is 10% by weight to 60% by weight.