The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2014

Filed:

Jul. 06, 2010
Applicants:

Jiang Zhe, Copley, OH (US);

Abhay Vasudev, Akron, OH (US);

Inventors:

Jiang Zhe, Copley, OH (US);

Abhay Vasudev, Akron, OH (US);

Assignee:

The University of Akron, Akron, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/447 (2006.01); G01N 27/453 (2006.01); B25B 11/00 (2006.01); B01L 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment, a system for manipulation of a micro component includes a gripper subsystem for lifting, holding, and releasing a micro component. The gripper subsystem includes a base substrate having a work side and an opposing side, a positive electrode secured to the work side of the base substrate, a negative electrode suitably spaced from the positive electrode and secured to the work side of the base substrate, a dielectric layer formed over the work side of the base substrate and the positive and negative electrodes, and a hydrophobic layer comprising a hydrophobic material with predictable electrowetting behavior formed over the dielectric layer such that the dielectric layer is between the work side of the base substrate and the hydrophobic layer. A method for manipulation of a micro component is also provided as well as a method of manufacturing the system for manipulation of a micro component.


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