The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2014

Filed:

Sep. 04, 2008
Applicants:

James C. Earthman, Irvine, CA (US);

Farghalli A. Mohamed, Huntington Beach, CA (US);

Rahul K. Mishra, Cockeysville, MD (US);

Indranil Roy, Liberal, KS (US);

Inventors:

James C. Earthman, Irvine, CA (US);

Farghalli A. Mohamed, Huntington Beach, CA (US);

Rahul K. Mishra, Cockeysville, MD (US);

Indranil Roy, Liberal, KS (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2006.01); B22F 1/02 (2006.01); C22C 1/05 (2006.01);
U.S. Cl.
CPC ...
Abstract

Thermal stability of cryomilled Al+1% diamantane was investigated in the temperature range of 423 to 773K. Diamantane is a nanosized hydrocarbon molecule with a 14 carbon atom diamond cubic framework that is terminated by hydrogen atoms. Following the cryomilling of the Al powders and diamantane cages, the average grain size characterized using transmission electron microscopy (TEM) and X-ray diffraction (XRD). The as-cryomilled grain sized was found to be of the order of 22 nm, essentially the same as that for Al cryomilled without diamantane. To determine thermal stability, the powders were sealed in glass tubes in an Ar atmosphere to avoid oxidation and contamination and annealed at different temperatures between 423 and 773K for different holding times. Following these treatments, the grain size of cryomilled Al+1% diamantane was consistently less than that for cryomilled Al by about a factor of two. Preliminary investigations indicate that the grain growth exponent n decreased with increasing temperature, reaching a value of approximately 35 at 423 K. Such a high value of n suggests the operation of strong pinning forces on boundaries during annealing treatment. The thermal stability data were found to be consistent with Burke's model based on drag forces exerted by dispersion particles.


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