The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2014

Filed:

Dec. 31, 2008
Applicants:

Michael William Barror, Gilbert, AZ (US);

William D. Verhoef, Andover, MN (US);

Joyce K. Yamamoto, Maple Grove, MN (US);

Robert S. Wentink, Lino Lakes, MN (US);

Gregory J. Haubrich, Champlin, MN (US);

Inventors:

Michael William Barror, Gilbert, AZ (US);

William D. Verhoef, Andover, MN (US);

Joyce K. Yamamoto, Maple Grove, MN (US);

Robert S. Wentink, Lino Lakes, MN (US);

Gregory J. Haubrich, Champlin, MN (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61N 1/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

An implantable medical device ('IMD') is provided having an antenna and an RF telemetry module for far field telemetry communications arranged on an exterior of the IMD housing, such that telemetry signal processing may be performed on the exterior of the housing. One or more feedthrough conductive paths extend through the housing to communicatively couple the RF module to circuitry within the housing. In this manner RF module is arranged entirely external to the housing, such that only power and/or low frequency data bit signals are required to be passed through the feedthrough conductive path. This allows the feedthrough conductive path to be filtered to prevent undesired interference signals (e.g., electromagnetic interference (EMI) signals) from entering the housing through the feedthrough conductive path coupled to the RF module. In some embodiments, the antenna and RF module are formed in an integrated assembly attachable to an exterior portion of the housing.


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