The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2014
Filed:
Jan. 25, 2011
Harumi Nishiguchi, Tokyo, JP;
Misao Hironaka, Tokyo, JP;
Kyosuke Kuramoto, Tokyo, JP;
Masatsugu Kusunoki, Tokyo, JP;
Yosuke Suzuki, Tokyo, JP;
Harumi Nishiguchi, Tokyo, JP;
Misao Hironaka, Tokyo, JP;
Kyosuke Kuramoto, Tokyo, JP;
Masatsugu Kusunoki, Tokyo, JP;
Yosuke Suzuki, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device includes a submount; a semiconductor laser mounted on the submount via solder in a junction-down manner. The semiconductor laser includes a semiconductor substrate, a semiconductor laminated structure containing a p-n junction, on the semiconductor substrate, and an electrode on the semiconductor laminated structure and joined to the submount via the solder. A high-melting-point metal or dielectric film is located between the submount and the semiconductor laminated structure and surrounds the electrode.