The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2014
Filed:
Sep. 14, 2011
Bily Wang, Hsinchu, TW;
Shih-yu Wu, Taipei County, TW;
Chao-yuan Huang, Tai Chung, TW;
Ping-chou Yang, Taipei County, TW;
Cheng-yen Chiang, Hsinchu, TW;
Bily Wang, Hsinchu, TW;
Shih-Yu Wu, Taipei County, TW;
Chao-Yuan Huang, Tai Chung, TW;
Ping-Chou Yang, Taipei County, TW;
Cheng-Yen Chiang, Hsinchu, TW;
Harvatek Corporation, Hsinchu, TW;
Abstract
An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.