The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2014
Filed:
Aug. 22, 2012
Kentaro Tujimoto, Inuyama, JP;
Kazuaki Toda, Inuyama, JP;
Kentaro Tujimoto, Inuyama, JP;
Kazuaki Toda, Inuyama, JP;
Daido Metal Company Ltd., Nagoya, JP;
Abstract
A copper-based sliding material including a steel back metal layer and a Cu alloy layer is provided. The Cu alloy layer contains 0.5 to 15 mass % of Sn, 0.2 to 5 mass % of inorganic compound particles and the balance being Cu and unavoidable impurities. The inorganic compound particles are dispersed in a Cu alloy matrix and have an average size of 1 to 10 μm. A ratio of a true density of the Cu alloy matrix in relation to that of the inorganic compound particles is 0.6 to 1.4 and a ratio of a thermal expansion coefficient of the Cu alloy matrix in relation to that of the inorganic compound particles is 1.5 to 3.0. An average distance between the inorganic compound particles dispersed in the Cu alloy matrix is 5 to 50 μm.