The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2014
Filed:
Jun. 10, 2011
Applicants:
Axel Kiesel, Chemnitz, DE;
Uwe Stoeckgen, Dresden, DE;
John Lampett, Dresden, DE;
Heiko Wundram, Floeha, DE;
Inventors:
Axel Kiesel, Chemnitz, DE;
Uwe Stoeckgen, Dresden, DE;
John Lampett, Dresden, DE;
Heiko Wundram, Floeha, DE;
Assignee:
Advanced Micro Devices, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24B 49/00 (2012.01); B24B 51/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad.