The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2013

Filed:

Jan. 07, 2013
Applicant:

Megica Corporation, Longtan, TW;

Inventors:

Mou-Shiung Lin, Hsin-Chu, TW;

Jin-Yuan Lee, Hsin-Chu, TW;

Chien-Kang Chou, Tainan Hsien, TW;

Assignee:

Megit Acquisition Corp., San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/528 (2006.01); H01L 21/70 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit chip includes a semiconductor substrate, a first circuit in or coupled to the semiconductor substrate, a second circuit device in or coupled the semiconductor substrate, a dielectric structure coupled the semiconductor substrate, a first interconnecting structure in the dielectric structure, a first pad connected to the first node of the voltage regulator through the first interconnecting structure, a second interconnecting structure in the dielectric structure, a second pad connected to the first node of the analog circuit through the second interconnecting structure, a passivation layer coupled the dielectric structure, wherein multiple openings in the passivation layer exposes the first and second pads, and a third interconnecting structure coupled the passivation layer and coupled the first and second pads.


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