The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2013
Filed:
Dec. 30, 2011
Hyung Gyun Yang, Icheon-si, KR;
Hyung Dong Lee, Icheon-si, KR;
Yong Kee Kwon, Icheon-si, KR;
Young Suk Moon, Icheon-si, KR;
Sung Wook Kim, Icheon-si, KR;
Hyung Gyun Yang, Icheon-si, KR;
Hyung Dong Lee, Icheon-si, KR;
Yong Kee Kwon, Icheon-si, KR;
Young Suk Moon, Icheon-si, KR;
Sung Wook Kim, Icheon-si, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A semiconductor apparatus includes first and second vias, a first circuit unit, a second circuit unit and a third circuit unit. The first and second vias electrically connect a first chip and a second chip with each other. The first circuit unit is disposed in the first chip, receives test data, and is connected with the first via. The second circuit unit is disposed in the first chip, and is connected with the second via and the first circuit unit. The third circuit unit is disposed in the second chip, and is connected with the first via. The first circuit unit outputs an output signal thereof to one of the first via and the second circuit unit in response to a first control signal.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile