The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2013
Filed:
Dec. 16, 2008
Katsuhiko Kamiya, Ibaraki, JP;
Takeshi Matsumura, Ibaraki, JP;
Shuuhei Murata, Ibaraki, JP;
Hironao Ootake, Ibaraki, JP;
Katsuhiko Kamiya, Ibaraki, JP;
Takeshi Matsumura, Ibaraki, JP;
Shuuhei Murata, Ibaraki, JP;
Hironao Ootake, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.