The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2013
Filed:
Dec. 03, 2007
Akira Okamura, Mie, JP;
Satoshi Nagai, Mie, JP;
Akira Okamura, Mie, JP;
Satoshi Nagai, Mie, JP;
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Abstract
Provided are a method of bonding resin materials for bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), and a structure obtained by the bonding method. The method includes preparing as the resin material (Y) a low-melting-point oxymethylene-based polymer (B) having a melting point lower than that of the oxymethylene-based polymer (A) by 5 to 50° C., or preparing as the resin material (Y) the resin material (X) or another resin material, and providing the low-melting-point oxymethylene-based polymer (B) between the resin material (Y) and the resin material (X) and heating resin materials.