The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 31, 2013

Filed:

Sep. 22, 2011
Applicants:

Ho-han Ryu, Suwon-si, KR;

Tae-seok Kim, Suwon-si, KR;

Seung-pyo Hong, Hwaseong-si, KR;

Seung-yeop Lee, Cheonan-si, KR;

Inventors:

Ho-Han Ryu, Suwon-si, KR;

Tae-Seok Kim, Suwon-si, KR;

Seung-Pyo Hong, Hwaseong-si, KR;

Seung-Yeop Lee, Cheonan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/34 (2006.01); F21V 7/04 (2006.01); B29D 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A stamp includes a metal supporting layer, a pattern forming layer and an adhesive layer. The metal supporting layer has a first thermal conductivity. The pattern forming layer is disposed on the metal supporting layer and has a surface with a molding pattern formed thereon. The adhesive layer is disposed between the metal supporting layer and the pattern forming layer to couple the pattern forming layer to the metal supporting layer, and has a second thermal conductivity lower than the first thermal conductivity. Thus, strength of the stamp may be improved, and deformation of the stamp during the process of manufacturing a light guide plate may be reduced or prevented.


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