The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2013
Filed:
Aug. 27, 2010
Masashi Numata, Chiba, JP;
Masashi Numata, Chiba, JP;
Seiko Instruments Inc., Chiba, JP;
Abstract
Providing a glass assembly cutting method capable of improving yield by cutting a glass assembly into a predetermined size, providing a package manufacturing method, a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic device, and a radio-controlled timepiece. Providing a wafer assembly cutting method of cutting a wafer assemblyalong a scribe line M', the method including: a scribing step of irradiating a laser beam having an absorption wavelength of the wafer assemblyalong the contour line to form the scribe line M′ on a lid board wafer; and a breaking step of applying a breaking stress along the scribe line M′ using a cutting blade to cut the wafer assembly along the scribe line M′, wherein the scribing step involves forming the scribe line M′ so that the ratio of a depth dimension D of the scribe line M′ to a width dimension W thereof is 0.8 or larger and 6.0 or smaller.