The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2013

Filed:

Oct. 18, 2011
Applicants:

Yutaka Tsuji, Osaka, JP;

Shigeru Nakayama, Osaka, JP;

Inventors:

Yutaka Tsuji, Osaka, JP;

Shigeru Nakayama, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/25 (2006.01); H01L 41/22 (2013.01); H04R 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate having appropriate strength and allowing firm bonding to a piezoelectric substrate and the like can be obtained at a lower cost. The substrate for an SAW device is formed of spinel, and PV value representing difference in level of one main surface of the substrate is at least 2 nm and at most 8 nm. Preferably, average roughness Ra of one main surface of the substrate is at least 0.01 nm and at most 0.5 nm. With such characteristics, the main surface of the substrate to be bonded to a piezoelectric substrate of the SAW device can be bonded satisfactorily to the piezoelectric material forming the piezoelectric substrate utilizing van der Waals interaction.


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