The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2013
Filed:
Nov. 02, 2011
Applicant:
Hirohisa Yasukawa, Kanagawa, JP;
Inventor:
Hirohisa Yasukawa, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device includes: a substrate including an electrode pad on a surface; a semiconductor chip placed on the substrate so as to be electrically connected to the electrode pad; a first resin layer which is formed on the substrate and is also filled between the substrate and the semiconductor chip; and a second resin layer, laminated on the first resin layer, which has an elastic modulus larger than that of the first resin layer.
Yasukawa, Hirohisa. (2013). Semiconductor device and method of manufacturing the same (U.S. Patent No. 8614517). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8614517
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile